I need a Matlab code that can simulate heat transfer moving through a surface. In the imagies and description below shows the parameters for the project.
A section of a typical power electronic package looks like as shown in Figure. An electronic device is placed on a copper circuit and acts as a heat source. The Cu circuit is attached to an electrical insulator aluminum nitride (AlN). Here electricity is arrested, whereas heat is allowed to dissipate further down to be removed. Another layer of copper helps spread heat more after AlN. The Cu – AlN – Cu structure, typically known as direct bonded copper (DBC) is soldered onto a heat sink, from where heat can be removed either by natural convection using fins (Like CPUs of our computers) or forced liquid convection in channels, such as shown in the Figure.
Now, we want to design a power electronic package that dissipates heat well using these channels and keeps the temperature of the top Cu surface at the heat source to a minimum for a durable device performance. In our problem it must be below 100°C.
Conductivities for Cu and AlN are 400 W/m-K and 170 W/m-K, respectively. The input heat flux and the geometry is shown in the Figure. Right hand side of the package is exposed to convection to ambient air at 25°C and h = 5 W/m2-K. Neglect radiatio
a) Use the steady state finite difference scheme that we studied in the class to find out
temperature profile of the cross section. Assume 5x1 grid size for the three thin layers and a reasonable size for the base copper. Plot the temperature profile graphically. No need to discretize the water domain – it is at a constant temperature of 25°C. Bottom of the package is insulated. Ignore the contact resistances.
b) Does your temperature profile make sense? Is your grid size enough to predict the temperature accurately?
c) See if the maximum temperature of the top surface is less than 100°C.
d) If not, what can you do make it less than 100°C.?